As advanced integration helps reduce development costs, reduce RF design challenges, shorten time to market, and simplify procurement and certification, wireless connectivity modules are becoming more and more popular among Industry 4.0 and Internet of Things (IoT) developers. A few days ago, Texas Instruments (TI) announced the launch of a new SimpleLink™ Bluetooth® low-power certification module equipped with an integrated antenna to expand its leading wireless connectivity module product portfolio, which can provide the largest coverage under ultra-low power consumption. In addition to the new Bluetooth low-power modules, TI modules can also be used to simplify the development of products that support Wi-Fi®, dual-mode Bluetooth, Wi-Fi + Bluetooth combination and other connection technologies.
Designing through TI's wireless connectivity module can provide developers with many advantages, including:
Industry-leading RF performance. Utilize the lowest power consumption to provide the widest coverage, and at the same time have proven interoperability and a large number of quality and reliability tests.
Faster development time. It mainly benefits from pre-certified modules for FCC/IC/CE/TELEC country-specific management regulations and Wi-Fi Alliance certification, as well as an integrated antenna and TI tool ecosystem. TI also provides a certified software stack for Bluetooth technical specifications. In addition, with the new SimpleLink Bluetooth low energy module, developers can flexibly use this module as a single-chip solution or a wireless network processor to easily add Bluetooth low power consumption to a wide range of IoT applications .
Proven and reliable power supply. Millions of TI modules have been sold all over the world, and they provide a simple migration path from modules to IC solutions to reduce additional costs. TI also provides support to customers worldwide through Texas Instruments' online support community and sales channels.
In addition to the TI module product portfolio, designers can also benefit from numerous third-party wireless module suppliers that use TI wireless chips, while obtaining other options such as form factors, antennas, software, and design services.
Development kits and evaluation modules
Development kits based on TI wireless connectivity modules are now available through TI Store or TI authorized distributors:
SimpleLink™ Bluetooth low energy CC2650MODA BoosterPack™ plug-in module SimpleLink Wi-Fi CC3200 module LaunchPad™ development kit
SimpleLink Wi-Fi CC3100 module BoosterPack plug-in module
Dual mode Bluetooth CC2564MODA module BoosterPack plug-in module
WiLink™ 8Wi-Fi + Bluetooth module development board:
WL1835MODCOM8B Evaluation Module
WL1837MODCOM8I Evaluation Module
WL18XXCOM82SDMMC Evaluation Module
